| Number of layers | 1-50 |
| Max. board thickness | 6.5 mm (256 mil) |
| PCB size | 626 x 537 mm (24.65" x 21.12") |
| Min. substrate thickness | 50 µm (2 mil) |
| Max. copper thickness | 170 µm (6.7 mil) |
| Line width/space (9 µm Cu) | 40/40 µm (1.6/1.6 mil) |
| Line width/space (18 µm Cu) | 50/50 µm (2/2 mil) |
| Min. laser vias | 50 µm (2 mil) |
| Aspect ratio, laser via size | 0.8:1, 80 µm (3.15 mil) |
| Min. mechanical vias | 100 µm (4 mil) |
| Aspect ratio, via size | 10:1, < 150 µm (< 6 mil) |
| Aspect ratio, via size | 26:1, > 150 µm (> 6 mil) |
| Annular ring | 50 µm (2 mil) |
| Annular ring (pattern plating) | 30 µm (1.2 mil) |
| Min. BGA pitch | 0.3 mm |
| Pad pitch (in-pad design) | 200 µm (7.9 mil) |
| Staggered/stacked microvias | 6+n+6 |
| DUT area planarity (100 mm size) | ± 12.5 µm (± 0.5 mil) |
| Controlled impedance tolerance | ± 5 % |
| Substrate material | FR4, High TG epoxy, High frequency, Stablcor, Thermount, CIC, Halogenfree |
| Surface finishes | OSP, HASL lead-free, Chem./Electrolytic Ni/Au, SnPb, Chem. Sn, Chem. Ag |
| Solder mask | Standard, Halogenfree, LDI |
Our capabilities are constantly evolving.
Do not hesitate to contact us if your application isn't within this range!
