Rigid and rigid-flex multilayer up to 50 layers
- Blind and buried vias
- Staggered and stacked vias
- Aspect ratio: 26:1
- Mechanical drilled hole size: > 0.10 mm
- Laser drilled microvias: ≥ 50 µm
- Board thickness: 0.10 up to 6.50 mm
- Board dimensions: 626 x 537 mm
- Minimum track and gap width: 40 µm
Delivery Times
- Fast turnaround and prototype service
- Up to 10 pieces: 3 - 5 working days
- 10 - 100 pieces: 5 - 15 working days
- 24-hour service available on request
Fast offer processing with alternative proposals for technical optimization and cost reduction
